專任教師
劉正毓教授
光電子材料實驗室
學校分機:34228
信箱:chengyi@cc.ncu.edu.tw
詳細介紹

電話:34228
信箱:chengyi@cc.ncu.edu.tw
研究室:工四館 E3-220
實驗室:光電子材料實驗室 E3-218
學歷:加州大學洛杉磯分校 材料科學與工程博士
研究領域:發光二極體 (LED),晶圓鍵合技術 (wafer bonding), 無線寬頻晶片覆晶封裝技術, 電致遷移及熱遷移研究,無鉛銲料

1. 研究計畫

半導體及光電產業在台灣蓬勃發展,已經成為台灣經濟命脈重要的一環 。為建立一高科技的綠色矽島,進一步提升半導體及光電科技技術極為重要的。我們知道材料的進展往往是科學技術進步的關鍵,許多重要的科學技術通常是建構於新的尖端材料的出現。因此本實驗室主要的方向為半導體及光電材料的研究開發,並且在製程及可靠度上也有相關研究。 
(a) Thin-GaN LED製程技術開發:包括晶圓鍵合、雷射剝離與金屬層電鍍process部份,接著再進行最後之LED之光學測量,得到發光效率。
(b) 覆晶凸塊電致遷移(Electromigration)研究:經由適當的實驗設計,得到不同銅及鎳添加量下銅錫及鎳錫合金的Z*值,而進一步建立教學的模型。
(c) 銅錫鎳介金屬化合物之整體研究:建立測量介金屬化合物基本性質的設備及方法,針對介金屬本身抗電遷移能力以及與銲料的濕論潤性做通盤的研究,並進行電遷移效應對於銲料與介金屬界面反應的研究。
(d) 發光二極體LED晶片覆晶封裝:以Flip-chip封裝的結構為目標,發展一良好的散熱系統,此一系統包含一散熱良好的基材及散熱途徑。
(e) 高介電高份子/金屬粉粒複合電容材料:將高份子/金屬粉粒材料的k值提昇,並尋找最佳的金屬摻雜密度及尺寸,以達成與PCB相容的高介電電容材料。在學術研究上我們必須探討因為金屬粉粒摻雜而提高介電常數的細部機制。
(f) 多層光學晶片鍵合及自動對準:將不同功能的光學晶片鍵結組合而成一光學系統,而達成整個光學系統微小化及積體化之目標。

Publications:

131  Shi, Jin-Wei, et al. "High-power and single-mode VCSEL arrays with single-polarized outputs by using package-induced tensile strain." Optics Letters 45.17 (2020): 4839-4842.
130  Huang, Che-Hsuan, et al. "Research on a Novel GaN-Based Converted Mini-LED Backlight Module via a Spectrum-Decouple System." IEEE Access 8 (2020): 138823-138833.

129  Chou, Chia-Yueh, et al. "High-dielectric-constant silicon nitride thin films fabricated by radio frequency sputtering in Ar and Ar/N2 gas mixture." Thin Solid Films 709 (2020): 138198.

128  Tang, Y. K., et al. "Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition." Materials Chemistry and Physics (2020): 122960.
127  Cheng, Cheng, et al. "Effect of annealing atmosphere (CO and N2 gas flow) on surface morphology and crystal quality of AlN buffer layer." Ceramics International (2020).
126  Wu, C. Y., et al. "Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni (P)." Journal of Electronic Materials 49.1 (2020): 26-33.

125  Wang, J. Y., et al. "Kinetics of Ni solid-state dissolution in Sn and Sn3. 5Ag alloys." Journal of Alloys and Compounds 797 (2019): 684-691.

124  Lin, Chia-Hua, et al. "Fabrication of p-type TiO2 and transparent p-TiO2/n-ITO pn junctions." AIP Advances 9.4 (2019): 045229.

123  Liao, Ching‐Han, et al. "Experiment and Theoretical Calculation of the Surface Space Charge Region Effect on Photocurrent Generation of SnO2 Bilayer Photodiode Devices." Advanced Electronic Materials 5.4 (2019): 1800679.

122  Chang, Pai-Jung, et al. "Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED." Journal of Electronic Materials 48.1 (2019): 194-200.

121  Lee, Po-Ming, et al. "Photocurrent generation in SnO2 thin film by surface charged chemisorption O ions." Applied Surface Science 442 (2018): 398-402.

120  Chen, Y. H., et al. "Mechanism of Ag sulfurization resistance improvement by alloying solutes in Ag-based alloy films." Journal of Applied Physics 123.24 (2018): 245305.

119  Tang, Y. K., et al. "Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems." Journal of Electronic Materials 47.1 (2018): 77-83.

118  Sun, Hui, et al. "p-type conductive NiOx: Cu thin films with high carrier mobility deposited by ion beam assisted deposition." Ceramics International 44.3 (2018): 3291-3296.

117  Wu, Y. J., et al. "Organic/inorganic F8T2/GaN light emitting heterojunction." Organic Electronics 49 (2017): 64-68.

116  Lin, E. J., et al. "Effect of Cu solubility on electromigration in Sn (Cu) micro joint." Journal of Applied Physics 122.9 (2017): 095702.

115  Lin, E. J., et al. "Effect of interfacial dissolution on electromigration failures at metals interface." Journal of Materials Science: Materials in Electronics 28.20 (2017): 15149-15153.

114  Liao, Ching-Han, et al. "Growth Direction Control of ZnO Nanorods on the Edge of Patterned Indium–Tin Oxide/Aluminum-Doped Zinc Oxide Bilayers." Crystal Growth & Design 17.6 (2017): 3100-3106.

113  Huang, S. W., et al. "Fabrication of nano-cavity patterned sapphire substrate using self-assembly meshed Pt thin film on c-plane sapphire substrate." Thin Solid Films 628 (2017): 127-131.

112  Tang, Y. K., et al. "LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System." Journal of Electronic Materials 45.12 (2016): 6171-6176.

111  Liu, C. Y., et al. "Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates." Journal of Electronic Materials 45.12 (2016): 6079-6085.

110  Chung, C. C., C. T. Yang, and C. Y. Liu. "Anelasticity of GaN Epitaxial Layer in GaN LED." Materials Research Express 3.10 (2016): 105026.

109  Lu, Chien-Chun, et al. "Effects of nighttime lights by LED and fluorescent lighting on human melatonin." Journal of Ambient Intelligence and Humanized Computing 7.6 (2016): 837-844.

108  Lu, Chien-Chun, et al. "The efficiency and reliability improvement by utilizing quartz airtight packaging of UVC LEDs." IEEE Transactions on Electron Devices 63.8 (2016): 3143-3146.

107  Lee, Po-Ming, et al. "Experimental observation and computer simulation of Al/Sn substitution in p-type aluminum nitride-doped tin oxide thin film." The Journal of Physical Chemistry C 120.8 (2016): 4211-4218.

106  Chen, Y. H., et al. "Sulfurization Study on the Ag and Ag-Pd Reflectors for GaN-Based LEDs." Journal of Electronic Materials 45.1 (2016): 191-196.

105  Liu, Wei Chih, et al. "Study of Al− Cu compounds as soldering bond pad for high-power device packaging." Microelectronics Reliability 55.12 (2015): 2549-2553.

104  Lee, Po-Ming, et al. "Observation of Ni3+ acceptor in P-type Ni (P): SnO2." Applied Surface Science 337 (2015): 33-37.

103  Li, Xu-Fong, et al. "Fabrication of patterned sapphire substrate and effect of light emission pattern on package efficiency." Optical Materials Express 5.8 (2015): 1784-1791.

102  Huang, S. W., et al. "Etching three-dimensional pattern on sapphire substrate by dynamic self-masking alunogen compound." ECS Solid State Letters 4.6 (2015): R35.

101  Villamagua, Luis, et al. "Change in the electrical conductivity of SnO2 crystal from n-type to p-type conductivity." Chemical Physics 452 (2015): 71-77.

100  Wu, Y. J., et al. "Preparation of V-doped AZO thin films and ZnO nanorods on V-doped AZO thin films by hydrothermal process." Journal of Sol-Gel Science and Technology 73.3 (2015): 647-654.

99    Wu, Yen-Ju, et al. "Local electronic structures and polarity of ZnO nanorods grown on GaN substrates." The Journal of Physical Chemistry C 119.9 (2015): 5122-5128.

98    Wu, Y. J., et al. "Study of p-type AlN-doped SnO2 thin films and its transparent devices." Applied Surface Science 328 (2015): 262-268.

97    Hsieh, Chih-Yi, et al. "Transparent p-AlN: SnO2/n-SnO2 tunnel diode." Applied Physics Express 7.9 (2014): 092201.

96    Sun, Ching-Cherng, et al. "Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy." Journal of Solid State Lighting 1.1 (2014): 19.

95    Lin, Yi Chin, et al. "Internal quantum efficiency enhancement by relieving compressive stress of GaN-based LED." IEEE Photonics Technology Letters 26.18 (2014): 1793-1796.

94    Liu, W. C., et al. "An electroless-Ag reflector developed for high-brightness white LEDs." Journal of electronic materials 43.12 (2014): 4602-4609.

93    Su, Chien-Hao, et al. "Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide." Journal of electronic materials 43.9 (2014): 3290-3295.

92    Liu, C. Y., et al. "Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface." ECS Solid State Letters 3.2 (2013): P17.

91    Liu, C. Y., et al. "Epitaxial Cu–Sn bulk crystals grown by electric current." Acta materialia 61.15 (2013): 5713-5719.

90    Li, Xu Feng, et al. "Nanomeshed Pt (Au) Transparent Contact to p-GaN of Light-Emitting Diode." Journal of electronic materials 43.1 (2014): 166-169.

89    Hu, Y. J., et al. "Interfacial Reactions Between Columnar or Layered Ni (P) Layers and Sn-Ag-Cu Solder." Journal of electronic materials 43.1 (2014): 277-283.

88    Hu, Y. J., et al. "Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints." Journal of electronic materials 43.1 (2014): 170-175.

87    Liu, Yen-Shuo, et al. "Mechanism of conductivity degradation of AZO thin film in high humidity ambient." Applied surface science 282 (2013): 32-37.

86    Lin, Y. H., et al. "Decoupling free-carriers contributions from oxygen-vacancy and cation-substitution in extrinsic conducting oxides." Journal of applied physics 113.3 (2013): 033706.

85    Liu, Yen‐Shuo, et al. "Optical and electrical characterization of transparent conductive Gd‐doped AZO thin films." physica status solidi (a) 210.3 (2013): 600-606.

84    Wu, Yen-Ju, et al. "Light extraction enhancement of vertical LED by growing ZnO nano-rods on tips of pyramids." IEEE Photonics Technology Letters 25.18 (2013): 1774-1777.

83    Lin, Y. C., et al. "Warpage and stress relaxation of the transferred GaN LED epi-layer on electroplated Cu substrates." Electronic Materials Letters 9.4 (2013): 441-444.

82    Liu, C. Y., et al. "Nitride-based concentrator solar cells grown on Si substrates." Solar energy materials and solar cells 117 (2013): 54-58.

81    Chung, Pao Tang, et al. "ZrO2/epoxy nanocomposite for LED encapsulation." Materials Chemistry and Physics 136.2-3 (2012): 868-876.

80    Lu, C. T., et al. "Effective charge number of Cu in Cu-Sn compound." ECS Solid State Letters 1.5 (2012): P73.

79    Liu, Y. S., et al. "Transparent p-type AlN: SnO2 and p-AlN: SnO2/n-SnO2: In2O3 pn junction fabrication." Applied Physics Letters 101.12 (2012): 122107.

78    Chang, You-Hsien, et al. "Light-extraction enhancement by cavity array-textured N-polar GaN surfaces ablated using a KrF laser." IEEE Photonics Technology Letters 24.22 (2012): 2013-2015.

77    Lin, H. Y., et al. "Pattern-coverage effect on light extraction efficiency of GaN LED on patterned-sapphire substrate." Electrochemical and Solid State Letters 15.3 (2011): H72.

76    Liu, Y. S., et al. "Formation of carriers in Ti-oxide thin films by substitution reactions." Journal of Applied Physics 111.4 (2012): 043103.

75    Chen, Y. J., et al. "Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding." Microelectronics Reliability 52.2 (2012): 381-384.

74    Song, Jenn-Ming, et al. "Nanomechanical responses of intermetallic phase at the solder joint interface–Crystal orientation and metallurgical effects." Materials Science and Engineering: A 534 (2012): 53-59.

73    Chang, You‐Hsien, Chun‐Ting Yang, and Cheng‐Yi Liu. "Light extraction improvement by forming volcanic crater on N‐polar GaN emitting surface." physica status solidi (a) 209.5 (2012): 998-1001.

72    Lin, H. Y., et al. "Characterization study of GaN-based epitaxial layer and light-emitting diode on nature-patterned sapphire substrate." Journal of Materials Research 27.6 (2012).

71    Liu, Y. S., et al. "Conductor formation through phase transformation in Ti-oxide thin films." Journal of electronic materials 41.1 (2012): 166-171.

70    Huang, Kuan-Chih, et al. "Ni interdiffusion coefficient and activation energy in Cu 6 Sn 5." Journal of electronic materials 41.1 (2012): 172-175.

69    Lu, C. T., et al. "Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures." Journal of electronic materials 41.1 (2012): 130-137.

68    Yang, C. T., W. C. Liu, and C. Y. Liu. "Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package." Microelectronics Reliability 52.5 (2012): 855-860.

67    Huang, T. S., et al. "Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates." Electrochemical and Solid State Letters 14.10 (2011): H393.

66    Liu, C. Y., et al. "A self-formed nanonetwork meshed Pt layer on an epitaxial GaN surface." Scripta Materialia 64.6 (2011): 533-536.

65    Huang, T. S., et al. "Growth Mechanism of a Ternary (Cu, Ni) 6 Sn 5 Compound at the Sn (Cu)/Ni (P) Interface." Journal of electronic materials 39.11 (2010): 2382-2386.

64    Huang, K. C., et al. "Study of interfacial reactions between Sn (Cu) solders and Ni-Co alloy layers." Journal of electronic materials 39.11 (2010): 2403-2411.

63    Lin, Yung Hsun, Y. S. Liu, and C. Y. Liu. "Light output enhancement of near UV-LED by using Ti-doped ITO transparent conducting layer." IEEE Photonics Technology Letters 22.19 (2010): 1443-1445.

62    Tseng, H. W., et al. "Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces." Microelectronics Reliability 50.8 (2010): 1159-1162.

61    Liu, C. Y., H. W. Tseng, and J. M. Song. "Variation of mechanical property and microstructure across Sn solder joint in Cu/Sn/Ni structure." Electrochemical and Solid State Letters 13.9 (2010): H298.

60    Lu, C. T., et al. "Retardation of electromigration-induced Ni (P) consumption by an electroless Pd insertion layer." Applied Physics Letters 96.23 (2010): 232103.

59    Chen, Yi-Ju, et al. "Fabrication of high-power InGaN-based light-emitting diode chips on pyramidally patterned sapphire substrate." Japanese Journal of Applied Physics 49.2R (2010): 020201.

58    Shi, Jin-Wei, et al. "Extremely high saturation current-bandwidth product performance of a near-ballistic uni-traveling-carrier photodiode with a flip-chip bonding structure." IEEE Journal of quantum electronics 46.1 (2009): 80-86.

57    Tseng, H. W., et al. "Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump." Electrochemical and Solid State Letters 12.12 (2009): H445.

56    Hsiao, Y. H., H. W. Tseng, and C. Y. Liu. "Electromigration-induced failure of Ni/Cu bilayer bond pads joined with Sn (Cu) solders." Journal of electronic materials 38.12 (2009): 2573.

55    Yen, Yee-Wen, et al. "Cross-interaction between Au/Sn and Cu/Sn interfacial reactions." Journal of electronic materials 38.11 (2009): 2257-2263.

54    Huang, Kuan-Chih, et al. "Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process." Journal of electronic materials 38.11 (2009): 2270-2274.

53    Lee, Y. Y., et al. "Surface oxidation of molten Sn (Ag, Ni, In, Cu) alloys." JOM 61.6 (2009): 52-58.

52    Lin, Y. H., and C. Y. Liu. "Reflectivity and abnormal absorption at ito/al interface." Journal of electronic materials 38.1 (2009): 108-112.

51    Lee, Ko-Tao, et al. "Mechanism underlying damage induced in gallium nitride epilayer during laser lift-off process." Japanese journal of applied physics 47.2R (2008): 930.

50    Tseng, H. W., and C. Y. Liu. "Evolution of Ag3Sn compound formation in Ni/Sn5Ag/Cu solder joint." Materials Letters 62.23 (2008): 3887-3889.

49    Chai, Yang, et al. "Electromigration studies of Cu/carbon nanotube composite interconnects using Blech structure." IEEE electron device letters 29.9 (2008): 1001-1003.

48    Chen, Po Han, et al. "Diamond heat spreader layer for high-power thin-GaN light-emitting diodes." IEEE photonics technology letters 20.10 (2008): 845-847.

47    Chen, P. H., et al. "Studies and issues of thin-GaN LED process." Seventh International Conference on Solid State Lighting. Vol. 6669. International Society for Optics and Photonics, 2007.

46    Hsu, S. C., et al. "Stress relaxation in GaN by transfer bonding on Si substrates." Applied Physics Letters 91.25 (2007): 251114.

45    Li, C. H., Y. C. Chuang, and C. Y. Liu. "Fabrication of Mg-based intermetallic compounds by liquid electromigration." Journal of electronic materials 36.11 (2007): 1489-1494.

44    Chuang, Y. C., and C. Y. Liu. "The effect of thermomigration on phase coarsening in a eutectic SnPb alloy." Journal of electronic materials 36.11 (2007): 1495-1500.

43    Chang, C. L., Y. C. Chuang, and C. Y. Liu. "Ag∕ Au Diffusion Wafer Bonding for Thin-GaN LED Fabrication." Electrochemical and Solid State Letters 10.11 (2007): H344.

42    Lin, C. L., et al. "Light enhancement by the formation of an Al oxide honeycomb nanostructure on the n-GaN surface of thin-GaN light-emitting diodes." Applied physics letters 90.24 (2007): 242106.

41    Chen, P. H., C. L. Lin, and C. Y. Liu. "Amorphous Si∕ Au wafer bonding." Applied physics letters 90.13 (2007): 132120.

40    Wang, S. J., and C. Y. Liu. "Coupling effect in Pt/Sn/Cu sandwich solder joint structures." Acta materialia 55.10 (2007): 3327-3335.

39    Liu, C. Y., et al. "Electromigration-induced Kirkendall voids at the Cu∕ Cu 3 Sn interface in flip-chip Cu∕ Sn∕ Cu joints." Applied physics letters 90.11 (2007): 112114.

38    Huang, Wei-Kuo, et al. "Flip-chip assembled GaAs pHEMT $ Ka $-band oscillator." IEEE microwave and wireless components letters 17.1 (2007): 67-69.

37    Chou, C. H., et al. "High thermally stable Ni∕ Ag (Al) alloy contacts on p-Ga N." Applied physics letters 90.2 (2007): 022103.

36    Kao, H. J., et al. "Effect of Cu additives on Sn whisker formation of Sn (Cu) finishes." Journal of electronic materials 35.10 (2006): 1885-1891.

35    Liu, C. Y., et al. "Study of electromigration-induced Cu consumption in the flip-chip Sn∕ Cu solder bumps." Journal of applied physics 100.8 (2006): 083702.

34    Lin, C. T., et al. "Current density dependence of electromigration-induced flip-chip Cu pad consumption." Applied physics letters 89.10 (2006): 101906.

33    Wang, S. J., and C. Y. Liu. "Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures." Journal of electronic materials 35.11 (2006): 1955-1960.

32    Wang, S. J., and C. Y. Liu. "Asymmetrical solder microstructure in Ni/Sn/Cu solder joint." Scripta materialia 55.4 (2006): 347-350.

31    Lee, Chien Chieh, et al. "Fabrication and tolerance reduction of a Si-based pickup module for optical storage." Optical Engineering 45.7 (2006): 074601.

30    Chuang, Y. C., and C. Y. Liu. "Thermomigration in eutectic SnPb alloy." Applied Physics Letters 88.17 (2006): 174105.

29    Hsu, S. C., and C. Y. Liu. "Fabrication of thin-GaN LED structures by Au–Si wafer bonding." Electrochemical and Solid State Letters 9.5 (2006): G171.

28    Lo, Shih-Shou, et al. "Fabricating a hollow optical waveguide for optical communication applications." Journal of microelectromechanical systems 15.3 (2006): 584-587.

27    Hsiao, Y. H., Y. C. Chuang, and C. Y. Liu. "Prevention of electromigration-induced Cu pad dissolution by using a high electromigration-resistance ternary Cu–Ni–Sn layer." Scripta materialia 54.4 (2006): 661-664.

26    Lai, Y. T., and C. Y. Liu. "Study of wetting reaction between eutectic AuSn and Au foil." Journal of electronic materials 35.1 (2006): 28-34.

25    Lo, Shih-Shou, et al. "Fabricating low-loss hollow optical waveguides via amorphous silicon bonding using dilute KOH solvent." IEEE photonics technology letters 17.12 (2005): 2592-2594.

24    Huang, Chang Pin, et al. "Metallurgical reactions of Sn-3.5 Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization." Journal of materials research 20.10 (2005): 2772-2779.

23    Wei, C. C., and C. Y. Liu. "Electromigration studies of Sn (Cu) and Sn (Ni) alloy stripes." Journal of materials research 20.8 (2005): 2072-2079.

22    Lin, C. L., S. J. Wang, and C. Y. Liu. "High-thermal-stability and low-resistance p-GaN contact for thin-GaN light emitting diodes structure." Electrochemical and Solid State Letters 8.10 (2005): G265.

21    Lin, C. L., S. J. Wang, and C. Y. Liu. "High thermal stable and low resistance contacts to p-GaN for thin-GaN LED." Fifth International Conference on Solid State Lighting. Vol. 5941. International Society for Optics and Photonics, 2005.

20    Liu, C. Y., and S. J. Wang. "An effective Cu-Sn barrier layer for Au bump used in optoelectronic devices." Journal of materials research 19.9 (2004): 2536-2540.

19    Wang, S. J., H. J. Kao, and C. Y. Liu. "Correlation between interfacial reactions and mechanical strengths of Sn (Cu)/Ni (P) solder bumps." Journal of electronic materials 33.10 (2004): 1130-1136.

18    Wang, S. J., and C. Y. Liu. "Retarding growth of Ni3P crystalline layer in Ni (P) substrate by reacting with Cu-bearing Sn (Cu) solders." Scripta materialia 49.9 (2003): 813-818.

17    Hsu, S. C., S. J. Wang, and C. Y. Liu. "Effect of Cu content on interfacial reactions between Sn (Cu) alloys and Ni/Ti thin-film metallization." Journal of electronic materials 32.11 (2003): 1214-1221.

16    Wang, S. J., and C. Y. Liu. "Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3. 5Ag-Cu sandwich structure." Journal of electronic materials 32.11 (2003): 1303-1309.

15    Lu, C. C., S. J. Wang, and C. Y. Liu. "Electromigration studies on Sn (Cu) alloy lines." Journal of electronic materials 32.12 (2003): 1515-1522.

14    Liu, C. Y., and S. J. Wang. "Prevention of spalling by the self-formed reaction barrier layer on controlled collapse chip connections under bump metallization." Journal of electronic materials 32.1 (2003): L1-L3.

13    Liu, C. Y., et al. "Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer." Journal of electronic materials 30.5 (2001): 521-525.

12    Huynh, Q. T., et al. "Electromigration in eutectic SnPb solder lines." Journal of applied physics 89.8 (2001): 4332-4335.

11    Jang, J. W., et al. "Interfacial morphology and shear deformation of flip chip solder joints." Journal of Materials Research 15.8 (2000): 1679-1687.

10    Tu, King-Ning, et al. "Effect of current crowding on vacancy diffusion and void formation in electromigration." Applied Physics Letters 76.8 (2000): 988-990.

9      Liu, C. Y., Chih Chen, and King-Ning Tu. "Electromigration in Sn–Pb solder strips as a function of alloy composition." Journal of Applied Physics 88.10 (2000): 5703-5709.

8      Liu, C. Y., et al. "Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes." Applied Physics Letters 75.1 (1999): 58-60.

7      Liu, C. Y., et al. "Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints." Journal of Applied Physics 85.7 (1999): 3882-3886.

6      Liu, C. Y., et al. "Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni (V)/Al thin film metallization." Journal of Applied Physics 87.2 (2000): 750-754.

5      Jang, J. W., et al. "Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology." Journal of Applied Physics 85.12 (1999): 8456-8463.

4      Liu, C. Y., and King-Ning Tu. "Reactive flow of molten Pb (Sn) alloys in Si grooves coated with Cu film." Physical Review E 58.5 (1998): 6308.

3      Zheng, D. W., et al. "Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film." Journal of materials research 13.5 (1998): 1103-1106.

2      Liu, C. Y., and King-Ning Tu. "Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition." Journal of materials research 13.1 (1998): 37-44.

1      Liu, C. Y., et al. "Dewetting of molten Sn on Au/Cu/Cr thin‐film metallization." Applied physics letters 69.26 (1996): 4014-4016.