電話：03-4227151 (分機34228)
信箱：chengyi@cc.ncu.edu.tw
研究室：工四館 E3-220-1
實驗室：光電子材料實驗室 E3-218
學歷：加州大學洛杉磯分校 材料科學與工程博士
研究領域：自組裝低溫錫膠、先進封裝技術、金屬表面處理及無鉛銲料、電鍍雙晶銅技術、散熱材料開發、可靠度測試研究、發光二極體 (LED)、透明導電薄膜。

想了解更多實驗室資訊，歡迎前往實驗室網站: https://reurl.cc/GdarmA

研究計畫:

半導體及光電產業在台灣蓬勃發展，先進封裝已經成為台灣經濟命脈的重要一環。為建立高科技的綠色矽島，進一步提升半導體及光電科技技術極為重要的。我們知道材料的進展往往是科學技術進步的關鍵，許多重要的科學技術通常是建構於新的尖端材料的出現。因此本實驗室主要的方向為半導體封裝及光電材料的研究開發，並且在製程及可靠度上也有相關研究。

1. Thin-GaN LED製程技術開發：包括晶圓鍵合、雷射剝離與金屬層電鍍製程部份，接著再進行最後之LED之光學測量，得到發光效率。
2. 發光二極體LED晶片覆晶封裝：以Flip-chip封裝的結構為目標，發展一良好的散熱系統，此一系統包含一散熱良好的基材及散熱途徑。
3. 電鍍雙晶銅技術：藉由開發(111)奈米雙晶銅電鍍製程製做奈米雙晶銅膜，因為內部高能量缺陷密度的降低，能有效降低電子散射及訊號傳遞的阻礙，使電流及訊號順利通過導體內部；在高頻低損、高機械強度、低電阻率、高電遷移抗性及良好的熱穩定性的同時，維持良好可靠度。
4. 低溫銅-銅直接鍵合技術: 藉由實驗室開發的多種銅微結構，可以製作出適合快速介面生長的銅晶粒，實現低溫低壓的銅-銅直接鍵合技術。
5. 自組裝低溫錫膠開發：本實驗室開發一款自組對位的錫膠，將其填充在晶片與基板之間，在加熱的過程中，晶片與基板的金屬接點間形成導電通路，導電通路外圍的膠液在加熱的過程中逐漸固化，最後完成底部充填保護銲點，經此一步驟完成一般覆晶封裝的流程。
6. 覆晶凸塊的電致遷移(Electromigration)研究：經由適當的實驗設計，得到不同銅及鎳添加量下銅錫及鎳錫合金的Z*值，而進一步建立教學的模型。同時，建立測量介金屬化合物基本性質的設備及方法，針對介金屬本身抗電遷移能力以及與銲料的濕論潤性做通盤的研究，並進行電遷移效應對於銲料與介金屬界面反應的研究。
7. 高介電高份子/金屬粉粒複合電容材料：將高份子/金屬粉粒材料的k值提昇，並尋找最佳的金屬摻雜密度及尺寸，以達成與PCB相容的高介電電容材料。在學術研究上我們必須探討因為金屬粉粒摻雜而提高介電常數的細部機制。
8. 奈米金屬(合金)顆粒/粉末：藉由調整反應系統中材料種類、濃度、溫度、時間等，來調整物質的長寬比，使產物具有不同的物理性質。因為其一維特性，常與高分子混合燒結成網狀薄膜，形成的交聯網絡於拉伸後仍具有良好的導電性，高孔隙率使其擁有高光穿透率且利於物質傳遞，3D結構的薄膜可增加材料的附著性。

Publications:
162  Lee, Yun-Fong, et al. "Low temperature Cu–Cu direct bonding in air ambient by ultrafast surface grain growth." Royal Society Open Science 11.9 (2024): 240459.
161  Li, Bao-Jhen, et al. "High transparent and conductive ZnO/Ag/ZnO film structure." Materials Today Communications (2024): 109201.
160  Hsu, Ya-Hui, et al. "Effect of expelling P content on Ni (P) dissolution and reaction with SnAgCu (Ni)." Journal of Materials Science: Materials in Electronics 35.10 (2024): 678.
159  Tsai, Chieh-Pu, et al. "Single-grain Sn-rich micro-bump by reducing Sn undercooling with heterogeneous nucleation." Materials Letters 357 (2024): 135729.
158  Chang, Jui-Sheng, et al. "Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films." JOM 76.6 (2024): 2711-2717.
157  Nhi Phan, Le Yen, et al. "Detecting glucose in a cell culture medium by surface-enhanced Raman scattering on InGaN quantum wells." Optics Continuum 2.12 (2023): 2509-2515.
156  Yen, Tzu-Hsuan, et al. "Enhancing capacitance of dielectric Si-oxide film by inserting indium-tin-oxide interlayer." Journal of Physics D: Applied Physics 56.33 (2023): 335101.
155  Lai, Tse-Lin, et al. "Low-temperature PECVD silicon-nitride passivation for perovskite solar cell." Materials Chemistry and Physics 294 (2023): 126880.
154  Yeh, C. Y., et al. "Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface." Journal of Materials Science: Materials in Electronics 33.34 (2022): 25580-25588.
153  Liu, C. Y., et al. "Wet-etching mechanism of a semi-sphere pattern on sapphire substrate." Materials Chemistry and Physics 281 (2022): 125863.

152  Chou, Chia-Yueh, et al. "Mechanism and quantum efficiency of yellow emission at the organic-inorganic F8T2/p-GaN interface." Surfaces and Interfaces 29 (2022): 101799.

151  Huang, Yen-YU, et al. "Low-Noise, Single-Polarized, and High-Speed Vertical-Cavity Surface-Emitting Lasers for Very Short Reach Data Communication." Journal of Lightwave Technology (2022): 3845-3854.

150  Huang, B. R., et al. "Cu Sintering Process Modified by Adding a Low Temperature Liquid Sintering Step." JOM 74.4 (2022): 1730-1738.

149  Liu, Cheng-Yi, et al. "Flexible multijunction solar cells embedded inside smart dust modules for outdoor applications to Smart Grids." Applied Energy 306 (2022): 117970.

148  Khan, Zuhaib, et al. "High-Brightness, High-Speed, and Low-Noise VCSEL Arrays for Optical Wireless Communication." IEEE Access (2021): 2303-2317.

147  Lin, Y. X., et al. "Effect of Ag Additives on the Consumption of a Cathode Cu Pad in a Cu/Sn3.5Ag/Cu Flip-Chip Structure Under Electromigration." Journal of Electronic Materials 50.12 (2021): 6584-6589.

146  Liu, Cheng-Yi, et al. "Pd/Cu (220) interdiffusion under compressive stress." Materials Chemistry and Physics 271 (2021): 124882.

145  Chou, C. Y., et al. "Morphological effect of patterned sapphire substrate on efficiency of white-light phosphor LED package." Optical Materials 119 (2021): 111297.

144  Nguyen, Thi Anh Nguyet, et al. "Controlling the Electron Concentration for Surface-Enhanced Raman Spectroscopy." ACS Photonics 8.8 (2021): 2410-2416.

143  Li, B. J., et al. "High-mobility ZnVxOy/ZnO conduction path in ZnO/V/ZnO multilayer structure." Journal of Applied Physics 130.7 (2021): 075302.

142  Chen, Wei‐Hao, et al. "Plastic deformation of ZnO thin films through edge and screw dislocation movements." Journal of the American Ceramic Society 104.12 (2021): 6579-6588.

141  Wu, C. Y., et al. "Study of galvanized Sn-finished Ag surface." Journal of Materials Science: Materials in Electronics 32.14 (2021): 18605-18615.

140  Lee, Chia-Hung, et al. "Effect of De-Twinning on Tensile Strength of Nano-Twinned Cu Films." Nanomaterials 11.7 (2021): 1630.

139  Huang, C. K., et al. "Measurement of internal electrical field across InGaN quantum wells in GaN LEDs." Materials Chemistry and Physics 265 (2021): 124514.

138  Huang, Chun-Kai, et al. "Flip‐Chip Packaged Perovskite Solar Cells." Energy Technology 9.7 (2021): 2001129.

137  Chien, Fan-Ching, et al. "Nanostructured InGaN Quantum Wells as a Surface-Enhanced Raman Scattering Substrate with Expanded Hot Spots." ACS Applied Nano Materials 4.3 (2021): 2614-2620.

136  Wang, Jyun-Yang, et al. "Effect of Ag solutes on the solid-state Cu dissolution in the Sn3.5Ag." Journal of Materials Science: Materials in Electronics 32.1 (2021): 567-576.

135  Wang, Jyun Yang, et al. "Effect of mixing glass frits on electrical property and microstructure of sintered Cu conductive thick film." Journal of the American Ceramic Society 104.4 (2021): 1707-1715.

134  Chen, Wei-Hao, et al. "Conductive and Transparent Properties of ZnO/Cu/ZnO Sandwich Structure." Journal of electronic materials 50.3 (2021): 779-785.

133  Lai, Wei-Han, et al. "Formation mechanism of self-formed triangular pyramidal patterns on sapphire substrate." Crystal Growth & Design 20.7 (2020): 4811-4817.

132  Shi, Jin-Wei, et al. "High-power and single-mode VCSEL arrays with single-polarized outputs by using package-induced tensile strain." Optics Letters 45.17 (2020): 4839-4842.

131  Huang, Che-Hsuan, et al. "Research on a Novel GaN-Based Converted Mini-LED Backlight Module via a Spectrum-Decouple System." IEEE Access 8 (2020): 138823-138833.
130  Chou, Chia-Yueh, et al. "High-dielectric-constant silicon nitride thin films fabricated by radio frequency sputtering in Ar and Ar/N₂ gas mixture." Thin Solid Films 709 (2020): 138198.
129  Tang, Y. K., et al. "Effect of eutectic reaction between depositing atoms and substrate elements on morphological evolution of Sn–Bi–Sn multilayer deposition." Materials Chemistry and Physics (2020): 122960.
128  Cheng, Cheng, et al. "Effect of annealing atmosphere (CO and N₂ gas flow) on surface morphology and crystal quality of AlN buffer layer." Ceramics International (2020).
127  Wu, C. Y., et al. "Effect of Chemical Additives in the Plating Bath on Surface Corrosion Resistance of Ni (P)." Journal of Electronic Materials 49.1 (2020): 26-33
126  Wang, J. Y., et al. "Kinetics of Ni solid-state dissolution in Sn and Sn3.5Ag alloys." Journal of Alloys and Compounds 797 (2019): 684-691.
125  Lin, Chia-Hua, et al. "Fabrication of p-type TiO₂ and transparent p-TiO₂/n-ITO pn junctions." AIP Advances 9.4 (2019): 045229.
124  Liao, Ching‐Han, et al. "Experiment and Theoretical Calculation of the Surface Space Charge Region Effect on Photocurrent Generation of SnO2 Bilayer Photodiode Devices." Advanced Electronic Materials 5.4 (2019): 1800679.
123  Chang, Pai-Jung, et al. "Fabrication of Aluminum Nitride Thermal Substrate and Low-Temperature Die-Bonding Process for High Power LED." Journal of Electronic Materials 48.1 (2019): 194-200.
122  Yang, Bo‐Xuan, et al. "Fully Solution‐Processed Low‐Voltage Driven Transparent Oxide Thin Film Transistors." physica status solidi (a) 215.24 (2018): 1800192.
121  Lee, Po-Ming, et al. "Photocurrent generation in SnO₂ thin film by surface charged chemisorption O ions." Applied Surface Science 442 (2018): 398-402.
120  Chen, Y. H., et al. "Mechanism of Ag sulfurization resistance improvement by alloying solutes in Ag-based alloy films." Journal of Applied Physics 123.24 (2018): 245305.
119  Tang, Y. K., et al. "Die-Bonding of LED Chips on Ag/Cu Substrate Using Sn/Zn/Bi/Sn and Sn/Bi/Zn/Bi/Sn Bonding Systems." Journal of Electronic Materials 47.1 (2018): 77-83.
118  Sun, Hui, et al. "p-type conductive NiOx: Cu thin films with high carrier mobility deposited by ion beam assisted deposition." Ceramics International 44.3 (2018): 3291-3296.
117  Wu, Y. J., et al. "Organic/inorganic F8T2/GaN light emitting heterojunction." Organic Electronics 49 (2017): 64-68.
116  Lin, E. J., et al. "Effect of Cu solubility on electromigration in Sn (Cu) micro joint." Journal of Applied Physics 122.9 (2017): 095702.
115  Lin, E. J., et al. "Effect of interfacial dissolution on electromigration failures at metals interface." Journal of Materials Science: Materials in Electronics 28.20 (2017): 15149-15153.
114  Liao, Ching-Han, et al. "Growth Direction Control of ZnO Nanorods on the Edge of Patterned Indium–Tin Oxide/Aluminum-Doped Zinc Oxide Bilayers." Crystal Growth & Design 17.6 (2017): 3100-3106.
113  Huang, S. W., et al. "Fabrication of nano-cavity patterned sapphire substrate using self-assembly meshed Pt thin film on c-plane sapphire substrate." Thin Solid Films 628 (2017): 127-131.
112  Tang, Y. K., et al. "LED Die-Bonded on the Ag/Cu Substrate by a Sn-BiZn-Sn Bonding System." Journal of Electronic Materials 45.12 (2016): 6171-6176.
111  Liu, C. Y., et al. "Study of Sn and SnAgCu Solders Wetting Reaction on Ni/Pd/Au Substrates." Journal of Electronic Materials 45.12 (2016): 6079-6085.
110  Chung, C. C., C. T. Yang, and C. Y. Liu. "Anelasticity of GaN Epitaxial Layer in GaN LED." Materials Research Express 3.10 (2016): 105026.
109  Lu, Chien-Chun, et al. "Effects of nighttime lights by LED and fluorescent lighting on human melatonin." Journal of Ambient Intelligence and Humanized Computing 7.6 (2016): 837-844.
108  Lu, Chien-Chun, et al. "The efficiency and reliability improvement by utilizing quartz airtight packaging of UVC LEDs." IEEE Transactions on Electron Devices 63.8 (2016): 3143-3146.
107  Lee, Po-Ming, et al. "Experimental observation and computer simulation of Al/Sn substitution in p-type aluminum nitride-doped tin oxide thin film." The Journal of Physical Chemistry C 120.8 (2016): 4211-4218.
106  Chen, Y. H., et al. "Sulfurization Study on the Ag and Ag-Pd Reflectors for GaN-Based LEDs." Journal of Electronic Materials 45.1 (2016): 191-196.
105  Liu, Wei Chih, et al. "Study of Al− Cu compounds as soldering bond pad for high-power device packaging." Microelectronics Reliability 55.12 (2015): 2549-2553.
104  Lee, Po-Ming, et al. "Observation of Ni3+ acceptor in P-type Ni (P): SnO₂." Applied Surface Science 337 (2015): 33-37.
103  Li, Xu-Fong, et al. "Fabrication of patterned sapphire substrate and effect of light emission pattern on package efficiency." Optical Materials Express 5.8 (2015): 1784-1791.
102  Huang, S. W., et al. "Etching three-dimensional pattern on sapphire substrate by dynamic self-masking alunogen compound." ECS Solid State Letters 4.6 (2015): R35.
101  Villamagua, Luis, et al. "Change in the electrical conductivity of SnO₂ crystal from n-type to p-type conductivity." Chemical Physics 452 (2015): 71-77.
100  Wu, Y. J., et al. "Preparation of V-doped AZO thin films and ZnO nanorods on V-doped AZO thin films by hydrothermal process." Journal of Sol-Gel Science and Technology 73.3 (2015): 647-654.
99    Wu, Yen-Ju, et al. "Local electronic structures and polarity of ZnO nanorods grown on GaN substrates." The Journal of Physical Chemistry C 119.9 (2015): 5122-5128.
98    Wu, Y. J., et al. "Study of p-type AlN-doped SnO₂ thin films and its transparent devices." Applied Surface Science 328 (2015): 262-268.
97    Hsieh, Chih-Yi, et al. "Transparent p-AlN: SnO₂/n-SnO₂ tunnel diode." Applied Physics Express 7.9 (2014): 092201.
96    Sun, Ching-Cherng, et al. "Packaging efficiency in phosphor-converted white LEDs and its impact to the limit of luminous efficacy." Journal of Solid State Lighting 1.1 (2014): 19.
95    Lin, Yi Chin, et al. "Internal quantum efficiency enhancement by relieving compressive stress of GaN-based LED." IEEE Photonics Technology Letters 26.18 (2014): 1793-1796.
94    Liu, W. C., et al. "An electroless-Ag reflector developed for high-brightness white LEDs." Journal of electronic materials 43.12 (2014): 4602-4609.
93    Su, Chien-Hao, et al. "Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide." Journal of electronic materials 43.9 (2014): 3290-3295.
92    Liu, C. Y., et al. "Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface." ECS Solid State Letters 3.2 (2013): P17.
91    Liu, C. Y., et al. "Epitaxial Cu–Sn bulk crystals grown by electric current." Acta materialia 61.15 (2013): 5713-5719.
90    Li, Xu Feng, et al. "Nanomeshed Pt (Au) Transparent Contact to p-GaN of Light-Emitting Diode." Journal of electronic materials 43.1 (2014): 166-169.
89    Hu, Y. J., et al. "Interfacial Reactions Between Columnar or Layered Ni (P) Layers and Sn-Ag-Cu Solder." Journal of electronic materials 43.1 (2014): 277-283.
88    Hu, Y. J., et al. "Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints." Journal of electronic materials 43.1 (2014): 170-175.
87    Liu, Yen-Shuo, et al. "Mechanism of conductivity degradation of AZO thin film in high humidity ambient." Applied surface science 282 (2013): 32-37.
86    Lin, Y. H., et al. "Decoupling free-carriers contributions from oxygen-vacancy and cation-substitution in extrinsic conducting oxides." Journal of applied physics 113.3 (2013): 033706.
85    Liu, Yen‐Shuo, et al. "Optical and electrical characterization of transparent conductive Gd‐doped AZO thin films." physica status solidi (a) 210.3 (2013): 600-606.
84    Wu, Yen-Ju, et al. "Light extraction enhancement of vertical LED by growing ZnO nano-rods on tips of pyramids." IEEE Photonics Technology Letters 25.18 (2013): 1774-1777.
83    Lin, Y. C., et al. "Warpage and stress relaxation of the transferred GaN LED epi-layer on electroplated Cu substrates." Electronic Materials Letters 9.4 (2013): 441-444.
82    Liu, C. Y., et al. "Nitride-based concentrator solar cells grown on Si substrates." Solar energy materials and solar cells 117 (2013): 54-58.
81    Chung, Pao Tang, et al. "ZrO₂/epoxy nanocomposite for LED encapsulation." Materials Chemistry and Physics 136.2-3 (2012): 868-876.
80    Lu, C. T., et al. "Effective charge number of Cu in Cu-Sn compound." ECS Solid State Letters 1.5 (2012): P73.
79    Liu, Y. S., et al. "Transparent p-type AlN: SnO₂ and p-AlN: SnO₂/n-SnO2: In₂O₃ pn junction fabrication." Applied Physics Letters 101.12 (2012): 122107.
78    Chang, You-Hsien, et al. "Light-extraction enhancement by cavity array-textured N-polar GaN surfaces ablated using a KrF laser." IEEE Photonics Technology Letters 24.22 (2012): 2013-2015.
77    Lin, H. Y., et al. "Pattern-coverage effect on light extraction efficiency of GaN LED on patterned-sapphire substrate." Electrochemical and Solid State Letters 15.3 (2011): H72.
76    Liu, Y. S., et al. "Formation of carriers in Ti-oxide thin films by substitution reactions." Journal of Applied Physics 111.4 (2012): 043103.
75    Chen, Y. J., et al. "Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bonding." Microelectronics Reliability 52.2 (2012): 381-384.
74    Song, Jenn-Ming, et al. "Nanomechanical responses of intermetallic phase at the solder joint interface–Crystal orientation and metallurgical effects." Materials Science and Engineering: A 534 (2012): 53-59.
73    Chang, You‐Hsien, Chun‐Ting Yang, and Cheng‐Yi Liu. "Light extraction improvement by forming volcanic crater on N‐polar GaN emitting surface." physica status solidi (a) 209.5 (2012): 998-1001.
72    Lin, H. Y., et al. "Characterization study of GaN-based epitaxial layer and light-emitting diode on nature-patterned sapphire substrate." Journal of Materials Research 27.6 (2012).
71    Liu, Y. S., et al. "Conductor formation through phase transformation in Ti-oxide thin films." Journal of electronic materials 41.1 (2012): 166-171.
70    Huang, Kuan-Chih, et al. "Ni interdiffusion coefficient and activation energy in Cu₆Sn₅." Journal of electronic materials 41.1 (2012): 172-175.
69    Lu, C. T., et al. "Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures." Journal of electronic materials 41.1 (2012): 130-137.
68    Yang, C. T., W. C. Liu, and C. Y. Liu. "Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package." Microelectronics Reliability 52.5 (2012): 855-860.
67    Huang, T. S., et al. "Abnormal Cu3Sn Growth and Kirkendall Formation Between Sn and (111) and (220) Preferred-Orientation Cu Substrates." Electrochemical and Solid State Letters 14.10 (2011): H393.
66    Liu, C. Y., et al. "A self-formed nanonetwork meshed Pt layer on an epitaxial GaN surface." Scripta Materialia 64.6 (2011): 533-536.
65    Huang, T. S., et al. "Growth Mechanism of a Ternary (Cu, Ni)₆Sn₅ Compound at the Sn (Cu)/Ni (P) Interface." Journal of electronic materials 39.11 (2010): 2382-2386.
64    Huang, K. C., et al. "Study of interfacial reactions between Sn (Cu) solders and Ni-Co alloy layers." Journal of electronic materials 39.11 (2010): 2403-2411.
63    Lin, Yung Hsun, Y. S. Liu, and C. Y. Liu. "Light output enhancement of near UV-LED by using Ti-doped ITO transparent conducting layer." IEEE Photonics Technology Letters 22.19 (2010): 1443-1445.
62    Tseng, H. W., et al. "Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces." Microelectronics Reliability 50.8 (2010): 1159-1162.
61    Liu, C. Y., H. W. Tseng, and J. M. Song. "Variation of mechanical property and microstructure across Sn solder joint in Cu/Sn/Ni structure." Electrochemical and Solid State Letters 13.9 (2010): H298.
60    Lu, C. T., et al. "Retardation of electromigration-induced Ni (P) consumption by an electroless Pd insertion layer." Applied Physics Letters 96.23 (2010): 232103.
59    Chen, Yi-Ju, et al. "Fabrication of high-power InGaN-based light-emitting diode chips on pyramidally patterned sapphire substrate." Japanese Journal of Applied Physics 49.2R (2010): 020201.
58    Shi, Jin-Wei, et al. "Extremely high saturation current-bandwidth product performance of a near-ballistic uni-traveling-carrier photodiode with a flip-chip bonding structure." IEEE Journal of quantum electronics 46.1 (2009): 80-86.
57    Tseng, H. W., et al. "Ag Electromigration Against Electron Flow in Sn5Ag/Cu Solder Bump." Electrochemical and Solid State Letters 12.12 (2009): H445.
56    Hsiao, Y. H., H. W. Tseng, and C. Y. Liu. "Electromigration-induced failure of Ni/Cu bilayer bond pads joined with Sn (Cu) solders." Journal of electronic materials 38.12 (2009): 2573.
55    Yen, Yee-Wen, et al. "Cross-interaction between Au/Sn and Cu/Sn interfacial reactions." Journal of electronic materials 38.11 (2009): 2257-2263.
54    Huang, Kuan-Chih, et al. "Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process." Journal of electronic materials 38.11 (2009): 2270-2274.
53    Lee, Y. Y., et al. "Surface oxidation of molten Sn (Ag, Ni, In, Cu) alloys." JOM 61.6 (2009): 52-58.
52    Lin, Y. H., and C. Y. Liu. "Reflectivity and abnormal absorption at ito/al interface." Journal of electronic materials 38.1 (2009): 108-112.
51    Lee, Ko-Tao, et al. "Mechanism underlying damage induced in gallium nitride epilayer during laser lift-off process." Japanese journal of applied physics 47.2R (2008): 930.
50    Tseng, H. W., and C. Y. Liu. "Evolution of Ag₃Sn compound formation in Ni/Sn5Ag/Cu solder joint." Materials Letters 62.23 (2008): 3887-3889.
49    Chai, Yang, et al. "Electromigration studies of Cu/carbon nanotube composite interconnects using Blech structure." IEEE electron device letters 29.9 (2008): 1001-1003.
48    Chen, Po Han, et al. "Diamond heat spreader layer for high-power thin-GaN light-emitting diodes." IEEE photonics technology letters 20.10 (2008): 845-847.
47    Chen, P. H., et al. "Studies and issues of thin-GaN LED process." Seventh International Conference on Solid State Lighting. Vol. 6669. International Society for Optics and Photonics, 2007.
46    Hsu, S. C., et al. "Stress relaxation in GaN by transfer bonding on Si substrates." Applied Physics Letters 91.25 (2007): 251114.
45    Li, C. H., Y. C. Chuang, and C. Y. Liu. "Fabrication of Mg-based intermetallic compounds by liquid electromigration." Journal of electronic materials 36.11 (2007): 1489-1494.
44    Chuang, Y. C., and C. Y. Liu. "The effect of thermomigration on phase coarsening in a eutectic SnPb alloy." Journal of electronic materials 36.11 (2007): 1495-1500.
43    Chang, C. L., Y. C. Chuang, and C. Y. Liu. "Ag∕ Au Diffusion Wafer Bonding for Thin-GaN LED Fabrication." Electrochemical and Solid State Letters 10.11 (2007): H344.
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